Low power audio LE Audio

On January 7, 2020, the Bluetooth Special Interest Group (SIG) released a new generation of Bluetooth audio technology standard, LE Audio, at CES2020 in Las Vegas.

LE Audio will use the new Low Complexity Communication Codec (LC3) to provide higher sound quality and lower power consumption. Compared with the SBC codec of the original Classic Audio, the LC3 will be able to provide higher sound quality without losing the sound quality even when the bit rate is reduced by 50%. Lower transmission bit rate requirements also mean lower energy consumption, which can greatly extend the use of audio equipment, and when the battery life is sufficient, developers can use smaller batteries to reduce the size of the headset and weight.

LE Audio's Multi-Stream Audio will allow a single audio source device such as a smartphone to synchronize multiple independent audio streams to a single or multiple audio receiving devices. This means that TWS headsets can directly achieve binaural simultaneous interpretation without additional technology, improving connection stability and reducing latency. The Bluetooth audio protocol directly supports binaural transmission from the protocol architecture will become the turning point of the TWS headset industry, and the competition pattern of the Bluetooth chip will change accordingly. Apple’s patent blockade of its Snoop monitoring technology will be meaningless. The technical threshold of the TWS headset chip will be It has been reduced to help accelerate the penetration of non-Apple TWS headphones. It is foreseeable that the development of the TWS headset connection solution based on LE Audio Bluetooth audio technology will become the main upgrade and competition direction in the future.

In the field of LE Audio, the leading chip design company Huiding Technology took the lead in layout. On January 7, 2020, Huiding Technology and OnePlus Technology demonstrated an innovative Bluetooth LE audio solution for TWS true wireless headphones at the CES2020 venue in Las Vegas, USA. This solution applies the Bluetooth LE audio and in-ear detection and touch technology of Huiding Technology, and fully supports the Bluetooth 5.1 standard and the ISOC (isochronous) architecture of the next generation Bluetooth LE, bringing innovative solutions for the future of the true wireless headset market. .

Huiding Technology's Bluetooth LE audio technology not only has ultra-low power consumption features, but also uses innovative software algorithms to achieve a series of differentiated functions: wireless multi-channel simultaneous connection, so that the left and right earbuds can be quickly identified and adapted and audio synchronization, ensuring Stable connection and power consumption balance for binaural transmission; ultra-low downlink delay for low-latency audio transmission; support for LC3 standard codec algorithm for better sound quality enjoyment; in addition, the newly released Bluetooth LE audio standard The framework can meet the needs of different application scenarios such as games and audio sharing. The solution also uses an ultra-low power consumption, ultra-small size full-capacitance in-ear detection and touch two-in-one chip, which can realize accurate wearing detection on the headset, smart interactive operations such as single double-click and sliding up and down.

Post time: 2020-09-04