Electric Toothbrush

  • From the perspective of brand cooperation, the main control chip competition pattern highlights the trend of head concentration

    The hotness of the TWS headset market has caused many chip manufacturers to compete on the Bluetooth audio SoC, constantly launching various Bluetooth true wireless solutions. Big brands with self-developed chips tend to use self-developed chips in order to obtain the best optimization of their own products, such as Apple and Huawei; chip suppliers in the mid-to-high-end market mainly include Qualcomm abroad and Hengxuan in mainland China; major players in other markets It is Realtek in Taiwan, Luoda and Jerry in mainland China. In terms of brand cooperation, apart from Apple, which always uses self-developed chips, other major manufacturers have their own preferred partners. According to Cinda Electronics Industry Chain research, Huawei’s early products used Hengxuan chips, the latest Freebuds 3 used self-developed A1 chips; Xiaomi mainly used Hengxuan and Realtek chips, and a few products used Qualcomm chips; OPPO mainly used Hengxuan chips ; Vivo mainly uses Qualcomm chips; Samsung always cooperates with Broadcom. Most foreign acoustic brands use Qualcomm chips. Recently, a small number of products have begun to use chips from domestic suppliers. For example, JBL adopted Hengxuan's BES2000 in its new product TUNE 120. Other small and medium-sized brands also have a large selection of chip suppliers. Mainland China has Zhuhai Jieli, Zhongke Lanxun, and Taiwan also has Realtek and Yuanxiang. Their TWS Bluetooth chips are relatively low-priced. The above chip manufacturers jointly supported the rapid growth of the TWS headset market in 2019. We have compiled the current mainstream TWS headset manufacturer's chip solutions. It can be seen that almost all current mainstream audio solutions support the Bluetooth 5.0 standard, and some products have begun to support the latest Bluetooth 5.1 standard. Compared with the full bloom of TWS brands, the trend of chip suppliers' head concentration is more obvious, and each manufacturer has a differentiated target market, such as Hengxuan, Qualcomm serving mainstream Android manufacturers, and other third-party brands. Zhuhai Jieli, Zhongke Lanxun, Realtek, etc. However, we believe that with the development of the TWS industry, this differentiated and polarized pattern will eventually be broken, and leading suppliers will broaden their product lines and…
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  • Low power audio LE Audio

    On January 7, 2020, the Bluetooth Special Interest Group (SIG) released a new generation of Bluetooth audio technology standard, LE Audio, at CES2020 in Las Vegas. LE Audio will use the new Low Complexity Communication Codec (LC3) to provide higher sound quality and lower power consumption. Compared with the SBC codec of the original Classic Audio, the LC3 will be able to provide higher sound quality without losing the sound quality even when the bit rate is reduced by 50%. Lower transmission bit rate requirements also mean lower energy consumption, which can greatly extend the use of audio equipment, and when the battery life is sufficient, developers can use smaller batteries to reduce the size of the headset and weight. LE Audio's Multi-Stream Audio will allow a single audio source device such as a smartphone to synchronize multiple independent audio streams to a single or multiple audio receiving devices. This means that TWS headsets can directly achieve binaural simultaneous interpretation without additional technology, improving connection stability and reducing latency. The Bluetooth audio protocol directly supports binaural transmission from the protocol architecture will become the turning point of the TWS headset industry, and the competition pattern of the Bluetooth chip will change accordingly. Apple’s patent blockade of its Snoop monitoring technology will be meaningless. The technical threshold of the TWS headset chip will be It has been reduced to help accelerate the penetration of non-Apple TWS headphones. It is foreseeable that the development of the TWS headset connection solution based on LE Audio Bluetooth audio technology will become the main upgrade and competition direction in the future. In the field of LE Audio, the leading chip design company Huiding Technology took the lead in layout. On January 7, 2020, Huiding Technology and OnePlus Technology demonstrated an innovative Bluetooth LE audio solution for TWS true wireless headphones at the CES2020 venue in Las Vegas, USA. This solution applies the Bluetooth LE audio and in-ear detection and touch technology of Huiding Technology, and fully supports the Bluetooth 5.1 standard and the ISOC (isochronous) architecture of the next generation Bluetooth LE, bringing innovative solutions…
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  • Noise reduction (active noise reduction + call noise reduction)

    Active noise reduction is mainly used to play audio, monitor the environmental noise through headphones, and then emit sound waves with opposite phases and equal intensity. After the two are superimposed, the noise is canceled. To achieve such a function, the headset needs an outgoing microphone to receive ambient noise, and the signal processing requires a certain time. Therefore, the main control chip needs to make a prediction of the future noise through a certain algorithm, and then play when the noise comes An opposite sound wave cancels it. Some high-end products also have an inward microphone, which is used to monitor the actual playback sound and provide feedback to achieve further calibration and optimization. At present, the latest TWS chips of Apple, Luoda, Hengxuan, Qualcomm, Realtek and other manufacturers have already supported the active noise reduction function, which is also the starting point for various manufacturers to improve the user experience In addition to achieving noise reduction when playing audio, call noise reduction is also essential. The purpose of call noise reduction is to selectively input the user's voice and filter the ambient noise when the user is speaking, so that the other party of the call can hear the user's speech more clearly. However, compared to active noise reduction, call noise reduction is more popular. At present, the mainstream call noise reduction technology on the market is a dual-mic noise reduction scheme. The principle is to capture voice signals through two microphones and filter other ambient sounds. Generally speaking, the talk microphone at the end of the TWS earphone handle is closer to the mouth, so the received voice will be much louder than that of the outgoing microphone, and the source of the ambient noise is about the same distance from the two microphones. The environmental noise intensity received by the two microphones is almost equal, and the differential amplifier between the two microphones subtracts and amplifies the signals received by the two microphones, and the environmental noise with similar reception intensity is filtered out, leaving behind The voice with a large intensity gap ensures the clarity…
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  • Noise reduction and LEAudio are the future upgrade directions

    The current TWS headset has basically achieved a relatively stable and fast connection, but considering that as a portable headset product, its application scenarios are often outdoor and public places, only the connection performance is not enough. Ensuring call quality when the noise is too loud or the signal is poor is a key factor to enhance the user experience. Looking into the future, the noise reduction function will gradually be popularized to mid-range models, and the LE Audio protocol that can achieve low bit rate and high sound quality transmission is expected to become the mainstream solution in the future.
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  • Improved power consumption + sinking prices for the development of TWS headphones

    In addition to connectivity, power consumption is also an important parameter of the TWS headphone chip. Lower power consumption will improve battery life and improve user experience. In addition, the decline in chip unit price will also help accelerate penetration. (1) Endurance At present, most of the TWS earphones on the market can achieve more than 3 hours of battery life, and even more so as Samsung Galaxy Buds+ has achieved up to 11 hours of battery life. The battery life of the headset is closely related to the power consumption of the chip. In the past, the power consumption of the Bluetooth chip was generally around 20mA. The power consumption of the Bluetooth headset chip of the AC6936d model was reduced to 6mA, the power consumption of the Hengxuan BES2300 chip was as low as 4mA, and the power consumption of the Qualcomm QCC5144 chip was 5mA. Compared with the past 20mA power consumption, the battery life improvement brought is a qualitative leap. The development of lower power consumption solutions in the future will also become one of the core competitiveness of chip manufacturers. Comparison of old and new chips (2) Price As more and more manufacturers enter, the price of TWS Bluetooth chips continues to sink. At present, the unit price of TWS Bluetooth chips from Qualcomm, Hengxuan, Luoda and other manufacturers is as low as 1-2 US dollars, and the main cost-effective chip suppliers such as mainland China The price of TWS Bluetooth headset chips provided by Jerry, Zhongke Lanxun and Realtek in Taiwan has fallen below US$1, which is one of the reasons for the explosive growth of white-brand TWS headsets in the second half of 2019. As a result, the shipments of these two manufacturers have soared, once reaching as high as about 50KK. In October 2019, Jieli and Zhongke Lanxun's TWS Bluetooth headsets accounted for more than 60% of the market, and cheap TWS chips with a cost of less than US$1 occupied most of the market. The reduction in the cost of the A-series TWS earphones has helped accelerate the penetration. The Android-based…
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  • Dual pass solution (Qualcomm TWS+, Huawei A1)

    Qualcomm early adopted the 2.4GHz TWS forwarding solution. In February 2018, Qualcomm launched the TWS+ (TrueWireless Stereo Plus) technology based on QCC5100 series chips. The mobile phone terminal sends two independent left and right channel audio signals to the left and right. headset. This dual-transmission scheme is a Q-to-Q connection technology that requires the support of a Bluetooth chip on the mobile phone. It can only be implemented on mobile phones equipped with Snapdragon 845, 670, 710 and later chips, on other platforms The headset will switch to the traditional high-latency forwarding mode. Although the compatibility is relatively poor, but due to Qualcomm's higher market share in the mobile phone SoC market, this solution also has a certain audience. Huawei's early TWS headset used Hengxuan's solution. In September 2019, Huawei released the new TWS headset Freebuds 3, equipped with the latest Kirin A1 chip, using self-developed dual-channel synchronous transmission technology, similar to Qualcomm TWS+ technology. Realize that the left and right headphones obtain the left and right channel Bluetooth signals from the mobile phone respectively. This chip is the first certified BT/BLE dual-mode Bluetooth 5.1 SoC, but it also needs to be used with Kirin SOC. Qualcomm TWS+ solution Here we make a horizontal comparative analysis of the advantages and disadvantages of the above three categories. It can be seen that in addition to traditional forwarding, the current mainstream chip solutions have solved the problems of connection delay and stability. However, in terms of compatibility, mainstream dual-pass solutions such as Qualcomm TWS and Huawei A1 need to be used in conjunction with the corresponding mobile phone SOC.
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  • Forwarding scheme (traditional forwarding, Hengxuan LBRT)

    The early non-Apple camp's TWS solution was the forwarding mode, that is, the mobile phone sent a two-channel audio signal, which was received by the main headset and then forwarded to the secondary headset. The scheme uses 2.4GHz Bluetooth signals to transmit audio, but the 2.4GHz frequency band is easily absorbed by the body, resulting in poor penetration and being easily interfered by WiFi and other Bluetooth signals. At the same time, due to the need for secondary forwarding, there is a large delay in audio playback, and the phenomenon of audio and picture is not synchronized. In addition, since the primary headset is responsible for forwarding signals, the power consumption is greater, and the uneven power consumption of the primary and secondary headsets also affects the user experience. In order to solve the delay problem of the traditional forwarding mode, the leading domestic TWS headset chip manufacturer Heng Xuan launched the BES2300 series chip of Low Band Retransmission (LBRT) in 2018. The mobile phone will use a two-channel 2.4GHz Bluetooth audio signal It is sent to the main earphone, and the main earphone sends a low-frequency magnetic induction forwarding signal to the sub earphone through the magnetic induction coil. The traditional forwarding mode has high delay and poor penetration, while Hengxuan’s main low-frequency magnetic induction signal has good penetration and fast response, and is not easily interfered by other 2.4GHz signals. Therefore, the delay is low and it can avoid loss of sound quality. Hengxuan's LBRT forwarding solution can greatly reduce power consumption, and can be connected to various sensors and memories, but low-frequency antennas need to be added to the headphones. Hengxuan's low-frequency forwarding solution bypasses Apple's patent blockade and provides a more cost-effective low-latency Bluetooth connection solution, which is used in Huawei Freebuds2 and Xiaomi TWS headphones. At the same time, this solution does not require the adaptation support of the mobile phone SoC, and can achieve better compatibility with different mobile phone platforms.
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  • Monitoring program (Apple Snoop, Luoda MCSync)

    The monitoring (Snoop) solution is mainly adopted by Apple. Since the AirPods generation, the company has adopted a self-developed monitoring solution. After the A headset is connected to the mobile phone terminal, the key is sent to the B headset. The B headset monitors the mobile phone audio signal through the key. Both AB earphones have a master chip with complete functions, so they can work as master earphones, and the master-slave earphones can be seamlessly switched when used in one ear. Apple's snoop solution has low connection delay and stable connection, and the phone only needs to send an audio signal, without the support of mobile terminal hardware and software. It has good compatibility between different platforms, and it can be paired with different mobile phones. Better connection performance.
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  • Detailed explanation of the connection solutions of various chip manufacturers, each of the three camps has its own characteristics

    The connection method is the essential difference between TWS headsets and traditional Bluetooth headsets, and its core points are low latency and stability. The traditional Bluetooth connection solution can only achieve the connection between the terminal and an audio device, so the traditional wireless headphones are head-mounted or neck-mounted, and the left and right speakers are wired, and the single main control chip receives the audio signal and distributes it to the left and right speakers . However, the TWS headset removes the shackles of wires, so chip manufacturers need to find another way to find audio connection solutions. Before LEAudio was launched, Bluetooth audio could only be connected one-to-one. In order to solve this problem, TWS chip manufacturers have developed various technical methods to ensure that the audio signal sent by the mobile phone can be transmitted to two headphones at the same time. At present, the mainstream solutions on the market can be divided into three types: monitoring, forwarding and dual transmission.
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